... should contain the following information to ensure that the finished board is to your requirements. - Always required even when a drill file is | CIRCUIT BOARDS | supplied, to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences between | CIRCUIT BOARDS | each size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, cutouts | CIRCUIT BOARDS | and slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our standard of + / | CIRCUIT BOARDS | -0.25 mm. Other information required for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = | CIRCUIT BOARDS | green) solder mask type (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer and fine line production | CIRCUIT BOARDS | runs) | EXTRA ...
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... / Burried Via Inner Layer / M/L Lamination -------------------------------------------------------------------------------- Multilayer Lamination Press ML Lamination Press The book is then transferred to the vacuum lamination | CIRCUIT BOARDS | press proved to be a major step forward. In this approach, the books are enclosed in a vacuum tight chamber, permitting lamination to take place | CIRCUIT BOARDS | in a vacuum environment. The press applies heat and pressure so that the thermosetting resin in the prepreg undergoes cross-linking which bonds all layers together. | CIRCUIT BOARDS | The press then goes through a critical cooling cycle before the book is removed and pulled apart. The edges of the multilayer panels are then | CIRCUIT BOARDS | trimmed to eliminate any of the resin outflow and to smooth out uneven or rough edges. Special attention was given to environmental compatibility and safety | CIRCUIT BOARDS | conditions. Furthermore, the facility was designed to accommodate future expansions. The requirements were as follows: - LP formats: Up to 640 x 610 mm - | CIRCUIT BOARDS | LP ...
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... complex electronics devices such as cell phones, personal digital assistants, and notebook computers, the PCB industry is experiencing an overwhelming rise in demand for | CIRCUIT BOARDS | high-density interconnect structures (HDIS). The demand for HDIS translates directly into a vigorous market for the microvias used in many of these multilayer substrates as | CIRCUIT BOARDS | well as in conventional PCBs. In 1998, for example, the worldwide microvia market made up about four percent of the total multilayer PCB market. By | CIRCUIT BOARDS | 2007 that market share is expected to expand to nearly 30 percent (Figure 1). Figure 1. Estimates predict | MICROVIA BOARDS | will comprise 29 | CIRCUIT BOARDS | percent of all buildup boards by 2007. Worldwide, the | TOTAL MICROVIA | market approached $4 billion in 2000 - up 63 percent over 1999 | CIRCUIT BOARDS | (Figure 2).1 By the end of 2001 the market should reach $5.6 billion - up another 50 percent over 2000. These same data show Japan | CIRCUIT BOARDS | as the microvia leader, followed by Europe, Asia, and North America. Several factors ...
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